This dissertation describes the formation and the characterization of ultra-thin (5 à 0,5 nm) silicon oxynitride (SiOxNy) films, through the oxidation and/or nitridation by high density ECR (Electron Cyclotron Resonance) plasma. The interest in these insulator films and in this technology, which allows reduce thermal stress on the wafer, grows with the increase of the integration levels and the complexity of the current devices and electronic circuits with dimensions sub-100 nm The films will be characterized by ellipsometry, infra-red spectrometry (FTIR) and ransmission electron microscopy (TEM). The ECR plasmas are going to characterize by optical emission spectroscopy (OES). The electrical characterization is going to be executed by capacitance x voltage (C-V) and the current x voltage (I-V) measurements. For application, as ultra thin gate dielectric of the current transistors with MIS structure, this films should present equivalent oxide thickness (EOT) smaller than to 5 nm, Si-O and Si-N bonds, which confirm the formation the SiOxNy, and gate leakage current densities smaller than 10A/cm2